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Failure Analysis Engineer


Singapore Production / Lean / Quality Management

Do you love developing cutting-edge innovations …
… and developing your career at the same time?

Then you've come to the right place! We can offer you plenty of space for your ideas, excellent development possibilities and exciting challenges.

In automotive production, water treatment plants or chemical systems - around the world, electronic sensors and automation components by Pepperl+Fuchs guarantee smooth and safe operations. We know that dedicated and highly motivated employees are crucial to our success. As we want to continue growing, we hope to find, as soon as possible, for our subsidiary in Singapore a

Failure Analysis Engineer

Job Purpose

Accurate and timely determination of failure root cause in product deviation so as to achieve long term P+F product quality.

Major Accountabilities

  • Perform failure analysis by assessing electrical and mechanical functionality of product deviation (production testing rejects etc.) to determine defective and/or non-compliant components and parts.
  • Support implementation of secondary process for accepted rework by creating documented instructions for TPU on how to identify defects and rework products / triggering M+S to update product routing for secondary process
  • Define reporting methodology (e.g. FPTY of products, PMM defective rate of components) for long term monitoring of product and component performances.
  • Key process owner to keep track and monitor aforementioned performances. Take necessary proactive actions (resolution and/or escalation) to rein in potential deviation from norm or threshold.
  • Daily failure analysis tasks include but limited to:
    • Measurement and comparison of electrical signals (e.g. via oscilloscope) with the desired outcome based on available production documentation (e.g. wiring diagram/ schematic, PCBA layout, routing, BoM)
    • Interpretation of results from various destructive and non-destructive techniques used in microelectronics such as Dye and Pry, Cross-Section, SEM, ICT, FCT, boundary scan etc. 
    • Work closely with SMT process engineers in determining reject root cause originating from failed or non-optimized SMT processes. 
  • Collaborate with stakeholders (e.g. Production, Production Support, Quality and Engineering) for timely and accurate root cause determination to facilitate implementation of sustainable corrective and prevention actions. 

  • Any other failure analysis related ad hoc responsibilities/tasks as assigned by the supervisor.

Job Specification

Education :

  • Min. a Diploma in Electronic and/or Electrical Engineering

  • Able to interpret mechanical drawing will be an added advantage


  • Min. 3 years’ experience of failure analysis on printed circuit board assembly
  • Strong diagnostic skills along with the capability to resolve circuit failure on both bench and system level
  • Experienced in SMT processes (pick-n-place, AOI, inline programming, reflow etc.) and PCBA quality control points will be an added advantage

Have we piqued your interest?

Then we would like to meet you. Send us your documents directly online. We look forward to your application!

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