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In automotive production, water treatment plants or chemical systems - around the world, electronic sensors and automation components by Pepperl+Fuchs guarantee smooth and safe operations. We know that dedicated and highly motivated employees are crucial to our success. As we want to continue growing, we hope to find, as soon as possible, for the following position in our subsidiary in Singapore:
Principal Process Engineer, SMT Process Engineering (IE)
Role Purpose:
As a Subject Matter Expert in this area, the successful person will be responsible for the following:
- Establish, optimize, and maintain a state-of-the-art, stable, and cost-efficient SMT process that supports both New Product Introduction (NPI) and volume production
- Acts as a technical authority on SMT process feasibility and innovation, ensuring seamless collaboration with R&D, Technology Development and production teams
- Achieve optimum Manufacturing by Design for Manufacturing / Assembly (DFM / DFA) inputs, review of components and material specifications, develop technical processes and tools to support industrialization of PCBAs
Major Accountabilities:
1. Technical Feasibilities & Process Development
- Conduct early-stage technical feasibility assessments of new PCBAs in collaboration with R&D during product design
- Define SMT process strategies for new designs based on complexity, component selection, board layout, and manufacturability
- Lead the development and validation of new SMT processes and technologies (e.g., fine-pitch, micro-BGA, PoP, 0201/01005 components)
- Drive prototyping and pilot builds to evaluate and refine processes prior to volume ramp-up
2. Technical Feasibilities & Process Development
- Act as the process engineering counterpart for PCBAs in PEP (Product Engineering Process) projects from concept through industrialization
- Ensure robust Design for Manufacturing (DfM) input is integrated into PCB and assembly designs early in the development phase
- Provide SMT-specific guidance on material selection, component footprint design, solder joint reliability, and stencil design
3. Process Standardization & Optimization, collaboration with Technology Development (TD)
- Lead trials and qualifications for new solder pastes, fluxes, nozzles, reflow profiles, etc
- Develop and maintain SMT process standards, best practices, and design rules in TD projects.
- Analyze process data to improve yield, cycle time, and equipment utilization
- Drive continuous improvement projects leveraging Six Sigma, SPC, DOE, or Lean methodologies
4. Technology Roadmapping & Innovation
- Monitor and evaluate emerging SMT technologies, materials, and equipment
- Identify opportunities for cost savings or capability expansion through new equipment or process enhancements
5. Cross-functional Support & Knowledge Sharing
- Collaborate with Maintenance + Service, Technology Development, Procurement and Quality to resolve technical challenges
- Train production and process engineers on new technologies and process changes
- Document and communicate lessons learned and technical know-how across global teams
Other Key Responsibilities:
- Responsible to provide R&D with DFM / DFA inputs, review component specifications and PCB layout to ensure PCBA are manufacturable with sustainable good quality by:
- Participate actively in Risk Assessment (DFMEA & PFMEA) and lead Design of Experiments (DOE)
- Review, develop and setup BoM and product structure for new PCBA
- Provide PCBA manufacturing expertise to Business Unit and Production to meet time to market, quality and cost
- Collaborate with R&D Department to ensure industrialized PCBAs are passing through relevant laboratory and certification tests through development and implementation of quality acceptance methods for samples and prototypes
- Conceptualize, develop machines and fixtures, release production processes and parameters in Manufacturing Technologies (SMT / THT):
- Develop work instructions and methods for new PCBA
- Verify new component solderability, process window, zero point, and pad design
- Develop machine programs and qualifying new process parameters for various types of machines in SMT
- Troubleshoot production processes during actual build to achieve good quality for customer
- Responsible for executing New Technology and Improvement Projects:
- Testing and implementing of new material, new tools and new machines (FAT/SAT) with Technology Development and R&D departments in Technology Project Work Packages
- Participate & implement Technology Work Packages at SEA regional level
- Analyze data, provide solutions for productivity improvement & structured problem solving
- Deliver PCBA NPI under new ExpressOPS initiatives:
- Industrialize new PCBAs and transfer current PCBAs between locations according to company initiatives Product Engineering Process (PEP) and Production to Production (PTP)
- Responsible as a technical lead of End-to-End prototyping needs of PCBA
Role Requirements:
- Bachelor’s Degree in Electronics / Mechatronics Engineering or equivalent education. A Master’s Degree or PhD in PCBA Process development is an added advantage
- 10-15 years of industry experience, of which a minimum of 8 years of hands-on experience in industrialization and development of SMT and Printed Circuit Board Assembly during product development phase
- Industry experience and hands-on in the following SMT & Soldering technologies and setting up machine programs (Pick & Place, Stencil Development, Solder Paste Printing, Solder Paste Inspection, Reflow Soldering Profile Development, Glue Jetting, V-groove and Router De-paneling, Wave/Selective/Manual/Reflow Soldering)
- Knowledge in DOE, SPC, APQP, DFSS, and using SPC to determine the interrelations of process parameters and processes results
- Knowledge and hands-on expertise in Minitab, JMP or QS-stat software for process development, FMEA and Control plans is an advantage
- Knowledge in DFM / DFA for SMT PCBA and able to support R&D designer to design the PCBA to suit our current SMT production setup
- Possess in-depth knowledge of industrial standards (IPC, J-STD, ISO, others) & practical knowledge of design, manufacturing process, common defect (e.g. design, materials, process-related) & how to troubleshoot them from the early (design) until the late (mass production) stages for the assigned technologies
- Proficient in English for both verbal and written communication
- Able to work independently as well as in a team
- Self-motivated with great initiative and ability to work well under pressure
Have we piqued your interest?
Then we would like to meet you. Please send your application online and we look forward to your application!
Benny Tan
Do you have any questions?
I would be pleased to assist you.
+65 6779 9091 2195
khtan@sg.pepperl-fuchs.com
Your contact
Benny Tan
If you have any questions, please write me an <a href="<a href="mailto:khtan@sg.pepperl-fuchs.com">khtan@sg.pepperl-fuchs.com</a>">E-Mail</a>. I am happy to help.
You can also contact me at
:
Tel: +65 6779 9091 2195
